Vikram Varadaraajan, PhD
Contact Information
Location: Rochester, Michigan
Email: firstnamelastname@gmail.com
Links: LinkedIn | Google Scholar
Professional Summary
Mechanical Engineer with over 10 years of experience in thermal and materials design, driving innovations across industries. By integrating AI and advanced engineering, I enhance efficiency, sustainability, and system performance. Known for enhancing product efficiency, automating complex processes, and delivering cross-disciplinary solutions by blending advanced engineering principles with cutting-edge AI technologies.
Professional Experience
Mechanical Engineering Specialist
Aptiv | Troy, Michigan | Jul 2023 – Present
- Spearheading innovation in automotive thermal management by combining engineering expertise with AI technologies. Led development of automated workflows for thermal simulations, enabling rapid prototyping and cost-efficient designs.
- Developed tools that combine engineering expertise with AI to streamline workflows, enhance energy efficiency, and solve complex challenges across thermal and mechanical systems.
Lead Design Engineer
Hella Electronics | Northville, Michigan | Jan 2022 – Jul 2023
- Optimized BEV thermal systems with advanced simulations, achieving a 22% reduction in system pressure drop.
- Contributed to developing patented onboard chargers for extreme temperature reliability.
- Collaborated with cross-functional teams to enhance thermal, electrical, and manufacturing designs.
Mechanical Design Lead
Somnio Global | Novi, Michigan | Jul 2014 – Dec 2021
- Led a team delivering high-impact automotive projects, including innovative brake rotor designs validated through simulations and SAE standards.
- Pioneered laser-assisted cold spray coating technology from concept to production, with custom optical window design (Transmission Efficiency 95% at 30bar, 600 degC.
- Secured US patent and scaled manufacturing process through statistical optimization.
Education
Academic Credentials
| Degree | Institution |
|---|---|
| PhD, Automotive Engineering | University of Michigan |
| MS, Mechanical Engineering | University of Michigan |
AI and Professional Development
- Neural Nets and Deep Learning Specialization (DeepLearning.AI, Coursera)
- Prompt Compression and Query Optimization (DeepLearning.AI, Coursera)
Technical Skills
| Category | Skills |
|---|---|
| AI & Machine Learning | AI model integration, React, Streamlit, AWS, Python |
| Data Visualization | Plotly, PyVis, Apache ECharts, PyDPF |
| Software Development | FastAPI, ArangoDB, Docker |
| Simulation Tools | Ansys, Fluent, CFX, OpenFOAM, Zemax |
| CAD/Design | CATIA, NX, SpaceClaim |
| Additive Manufacturing | 3D Printing (SLA, FDM), Direct Metal Deposition |
| Manufacturing | CNC Mill, Lathe, Die Casting, EDM |
Certifications
- High Voltage Vehicle Safety Systems (SAE), 2022
- Power Electronics Design Bootcamp, University of Wisconsin-Madison, 2022
Selected Publications and Patents
Materials
- Composite Metal Alloy Material (Ford Motor Co)
- Developed a low-cost, wear-resistant iron alloy compatible with aluminum alloys
- Addressed galvanic corrosion challenges in mixed-metal applications
- Patent Link
- Nitrogen Alloy Protective Layer (Somnio Global)
- Optimized nitrogen-based alloys for enhanced wear and corrosion resistance
- Utilized advanced solid-state diffusion techniques
- Patent Link
- Free Radical Generation Device and Methods Thereof (University of Michigan)
- Designed a barrierless device for generating high-efficiency free radicals using solid/liquid electrodes
- Utilized streamer discharge technology for fast chemical reactions and advanced radical generation
- Patent Link
CFD and Design Projects
- Wheel and Brake Assemblies (Somnio Global)
- Designed cooling fins for in-wheel brake assembly
- Enhanced conjugate heat transfer in transient domains
- Implemented moving mesh simulations
- Patent Link
- Cold Spray Apparatus (University of Michigan)
- Designed multi-nozzle delivery system for cold gas dynamic spray
- Increased deposition efficiency by 50%
- Expanded deposition footprint reducing overlap layers and material wastage
- Patent Link